Cooling Copper Sheet for M.2 Heatsink NVME Heat Sink NGFF for M.2 2280 Thermal Conductivity Silicone Wafer Cooling Fan C
Product details
| Management number | 239447564 | Release Date | 2026/07/14 | List Price | US$3.23 | Model Number | 239447564 | ||
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Features: --Made of high-quality metal material, durable, firm and stable for us to use. --Professional aluminum radiator and anoxdic oxidation treatment, better heat dissipation performance. --The thermal pads can use to fill the chip and flash memory chips height and increase the cooling effect. --High temperature silicone ring, easy to install and easy to disassemble. --Easy and convenient for us to install and remove.If you have any after-sales problems, please contact us as soon as possible.
- --Made of high-quality metal material, durable, firm and stable for us to use.
- --Professional aluminum radiator and anoxdic oxidation treatment, better heat dissipation performance.
- --The thermal pads can use to fill the chip and flash memory chips height and increase the cooling effect.
- --High temperature silicone ring, easy to install and easy to disassemble.
- --Easy and convenient for us to install and remove.If you have any after-sales problems, please contact us as soon as possible.
| ASIN | B0H6FK39VD |
|---|---|
| Brand Name | APGLSXY |
| Item Weight | 18 Grams |
| Part Number | 4NB601497_YXZ |
| Manufacturer | APGLSXY |
| Included Components | as described |
| Global Trade Identification Number | 17801007440604 |
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